TAP154M050BCS [KYOCERA AVX]
Tantalum Capacitor, Polarized, Tantalum (dry/solid), 50V, 20% +Tol, 20% -Tol, 0.15uF, Through Hole Mount, RADIAL LEADED;
| 型号： | TAP154M050BCS |
| 厂家： | 
KYOCERA AVX |
| 描述： | Tantalum Capacitor, Polarized, Tantalum (dry/solid), 50V, 20% +Tol, 20% -Tol, 0.15uF, Through Hole Mount, RADIAL LEADED 电容器 |
| 文件： | 总21页 (文件大小：900K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Dipped Radial Capacitors
Introduction
SOLID TANTALUM RESIN DIPPED
SERIES TAP
The TAP resin dipped series of miniature tantalum capacitors
is available for individual needs in both commercial and
professional applications. From computers to automotive to
industrial, AVX has a dipped radial for almost any application.
Tantalum
Graphite
Resin encapsulation
Tantalum Wire
Terminal Wire
Silver
Solder
Manganese
dioxide
Tantalum
pentoxide
2
Dipped Radial Capacitors
Wire Form Outline
SOLID TANTALUM RESIN DIPPED TAP
Preferred Wire Forms
D
D
D
Figure 1
Figure 2
Figure 3
2.0(0.08)
max
H1
H
L
H1 + 4 (0.16)
max
+
+
L
S
L
S
S
d
d
2 (0.079)
min
2 (0.079)
min
d
Wire Form C
Wire Form B
Wire Form S
Non-Preferred Wire Forms (Not recommended for new designs)
Figure 4 Figure 5
Figure 6
D
D
D
H1 max
+0.118
(3.0)
H + 3.8 (0.15)
max
H
+
0.079 (2)
min
L
L
+0.25
1.10
L
-0.10
S
+0.010
-0.004
S
(0.4
)
d
d
S
Wire Form F
Wire Form D
Wire Form G
DIMENSIONS
millimeters (inches)
Packaging
Suffixes Available*
Wire Form
Figure
Case Size
L (see note 1)
S
d
Preferred Wire Forms
CCS Bulk
CRW Tape/Reel
CRS Tape/Ammo
16±4
5.0±1.0
0.5±0.05
C
B
S
Figure 1
Figure 2
Figure 3
A - R*
A - J*
A - J*
(0.630±0.160)
(0.200±0.040)
(0.020±0.002)
BCS Bulk
BRW Tape/Reel
BRS Tape/Ammo
16±4
(0.630±0.160)
5.0±1.0
(0.200±0.040)
0.5±0.05
(0.020±0.002)
SCS Bulk
SRW Tape/Reel
16±4
(0.630±0.160)
2.5±0.5
(0.100±0.020)
0.5±0.05
(0.020±0.002)
SRS
Tape/Ammo
Non-Preferred Wire Forms (Not recommended for new designs)
3.9±0.75
(0.155±0.030)
5.0±0.5
(0.200±0.020)
0.5±0.05
(0.020±0.002)
F
Figure 4
Figure 5
Figure 6
A - R
FCS
Bulk
DCS Bulk
DTW Tape/Reel
16±4
(0.630±0.160)
2.5±0.75
(0.100±0.020)
0.5±0.05
(0.020±0.002)
D
A - H*
DTS
Tape/Ammo
16±4
(0.630±0.160)
3.18±0.5
(0.125±0.020)
0.5±0.05
(0.020±0.002)
G
H
A - J
GSB Bulk
HSB Bulk
Similar to
Figure 1
16±4
(0.630±0.160)
6.35±1.0
(0.250±0.040)
0.5±0.05
(0.020±0.002)
A - R
Notes: (1) Lead lengths can be supplied to tolerances other than those above and should be specified in the ordering information.
(2) For D, H, and H1 dimensions, refer to individual product on following pages.
For case size availability in tape and reel, please refer to page 7-8.
*
3
Dipped Radial Capacitors
TAP Series
SOLID TANTALUM RESIN DIPPED
CAPACITORS
TAP is a professional grade device manufactured with a
flame retardant coating and featuring low leakage current
and impedance, very small physical sizes and exceptional
temperature stability. It is designed and conditioned to
operate to +125°C (see page 27 for voltage derating
above 85°C) and is available loose or taped and reeled for
auto insertion. The 15 case sizes with wide capacitance and
working voltage ranges means the TAP can accommodate
almost any application.
Maximum Case Dimensions: millimeters (inches)
Wire
Case
A
B
C
D
E
F
G
H
J
K
L
M
N
P
C, F, G, H
H
B, S, D
*H1
D
8.5 (0.33)
9.0 (0.35)
10.0 (0.39)
10.5 (0.41)
10.5 (0.41)
11.5 (0.45)
11.5 (0.45)
12.0 (0.47)
13.0 (0.51)
14.0 (0.55)
14.0 (0.55)
14.5 (0.57)
16.0 (0.63)
17.0 (0.67)
18.5 (0.73)
7.0 (0.28)
7.5 (0.30)
8.5 (0.33)
9.0 (0.35)
9.0 (0.35)
10.0 (0.39)
10.0 (0.39)
10.5 (0.41)
11.5 (0.45)
12.5 (0.49)
12.5 (0.49)
13.0 (0.51)
4.5 (0.18)
4.5 (0.18)
5.0 (0.20)
5.0 (0.20)
5.5 (0.22)
6.0 (0.24)
6.5 (0.26)
7.0 (0.28)
8.0 (0.31)
8.5 (0.33)
9.0 (0.35)
9.0 (0.35)
9.0 (0.35)
10.0 (0.39)
10.0 (0.39)
D
H
R
HOW TO ORDER
TAP
475
M
035
SCS
Type
Capacitance Code
pF code: 1st two digits
represent significant figures,
3rd digit represents multiplier
(number of zeros to follow)
Capacitance Tolerance
K = ±10%
M = ±20%
(For J = ±5% tolerance,
please consult factory)
Rated DC Voltage
Suffix indicating wire form
and packaging
(see page 3)
4
Dipped Radial Capacitors
TAP Series
TECHNICAL SPECIFICATIONS
Technical Data:
All technical data relate to an ambient temperature of +25°C
Capacitance Range:
Capacitance Tolerance:
0.1µF to 330µF
±20%; ±10% (±5% consult your AVX representative for details)
6.3 10 16 20 25 35 50
Rated Voltage DC (V )
Ϲ+85°C:
Ϲ+125°C:
Ϲ+85°C:
R
Category Voltage (V )
4
8
5
6.3 10 13 16 23 33
13 20 26 33 46 65
C
Surge Voltage (V )
S
Ϲ+125°C:
9
12 16 21 28 40
Temperature Range:
-55°C to +125°C
Environmental Classification:
Dissipation Factor:
55/125/56 (IEC 68-2)
Ϲ0.04 for CR 0.1-1.5µF
Ϲ0.06 for CR 2.2-6.8µF
Ϲ0.08 for CR 10-68µF
Ϲ0.10 for CR 100-330µF
Reliability:
1% per 1000 hrs. at 85°C with 0.1Ω/V series impedance, 60% confidence level.
Capacitance Range (letter denotes case code)
Capacitance Rated voltage DC (V )
R
µF
Code
104
6.3V
10V
16V
20V
25V
35V
50V
0.1
0.15 154
0.22 224
A
A
A
A
A
A
0.33 334
0.47 474
0.68 684
A
A
A
A
A
B
1.0
1.5
2.2
105
155
225
A
A
A
A
A
A
A
A
B
C
D
E
A
A
A
3.3
4.7
6.8
335
475
685
A
A
A
A
A
B
A
B
C
B
C
D
B
C
D
C
E
F
F
G
H
10
15
22
106
156
226
B
C
D
C
D
E
D
E
F
E
F
H
E
F
H
F
H
K
J
K
L
33
47
68
336
476
686
E
F
G
F
G
H
F
J
L
J
K
N
J
M
N
M
N
100
150
220
107
157
227
H
K
M
K
N
P
N
N
R
N
330
337
P
R
Values outside this standard range may be available on request.
AVX reserves the right to supply capacitors to a higher voltage rating, in the same case size, than that ordered.
MARKING
Polarity, capacitance, rated DC voltage, and an "A" (AVX
logo) are laser marked on the capacitor body which is made
of flame retardant gold epoxy resin with a limiting oxygen
index in excess of 30 (ASTM-D-2863).
• Tolerance code:
±20% = Standard (no marking)
• Polarity
• Capacitance
• Voltage
+
A
10µ
16
±10% = “K” on reverse side of unit
±5% = “J” on reverse side of unit
• AVX logo
5
Dipped Radial Capacitors
TAP Series
RATINGS AND PART NUMBER REFERENCE
AVX
Part No.
Case Capacitance
Size µF
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
AVX
Part No.
Case Capacitance
Size µF
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
6.3 volt @ 85°C (4 volt @ 125°C)
20 volt @ 85°C (13 volt @ 125°C) continued
TAP 335( )006
A
A
A
B
C
D
E
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
330
0.5
0.5
0.5
0.5
0.8
1.1
1.7
2.4
3.4
5.0
7.6
11.0
16.6
6
6
6
8
8
8
8
8
8
10
10
10
10
13.0
10.0
8.0
6.0
5.0
3.7
3.0
2.0
1.8
1.6
0.9
0.9
0.7
TAP 336( )020
J
33
47
68
5.2
7.5
10.8
16.0
8
8
8
1.4
1.2
0.9
0.6
*
*
TAP 475( )006
*
TAP 476( )020
*
K
N
N
TAP 685( )006
*
TAP 686( )020
*
TAP 106( )006
*
TAP 107( )020
*
100
10
TAP 156( )006
*
25 volt @ 85°C (16 volt @ 125°C)
TAP 226( )006
*
TAP 336( )006
*
TAP 105( )025
A
A
A
B
C
D
E
1.0
1.5
2.2
3.3
4.7
6.8
0.5
0.5
0.5
0.6
0.9
1.3
2.0
3.0
4.4
6.6
9.4
13.6
4
4
6
6
6
6
8
8
8
8
8
8
10.0
8.0
6.0
5.0
4.0
3.1
2.5
2.0
1.5
1.2
1.0
0.8
*
TAP 476( )006
*
F
TAP 155( )025
*
TAP 686( )006
*
G
H
K
M
P
TAP 225( )025
*
TAP 107( )006
*
TAP 335( )025
*
TAP 157( )006
*
TAP 475( )025
*
TAP 227( )006
*
TAP 685( )025
*
TAP 337( )006
*
TAP 106( )025
*
10
TAP 156( )025
*
F
H
J
M
N
15
22
33
47
68
10 volt @ 85°C (6.3 volt @ 125°C)
TAP 226( )025
*
TAP 225( )010
A
A
A
B
C
D
E
2.2
3.3
4.7
6.8
10
15
22
33
47
68
0.5
0.5
0.5
0.5
0.8
1.2
1.7
2.6
3.7
5.4
8.0
12.0
17.6
20.0
6
6
6
6
8
8
8
8
8
13.0
10.0
8.0
6.0
5.0
3.7
2.7
2.1
1.7
1.3
1.0
0.8
0.6
0.5
TAP 336( )025
*
*
TAP 335( )010
*
TAP 476( )025
*
TAP 475( )010
*
TAP 686( )025
*
TAP 685( )010
*
35 volt @ 85°C (23 volt @ 125°C)
TAP 106( )010
*
TAP 156( )010
*
TAP 104( )035
A
A
A
A
A
A
A
A
B
C
E
0.1
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.6
0.9
1.3
1.9
2.8
4.2
6.1
9.2
10.0
4
4
4
4
4
4
4
4
6
6
6
6
8
8
8
8
8
26.0
21.0
17.0
15.0
13.0
10.0
8.0
6.0
5.0
4.0
3.0
2.5
2.0
1.6
1.3
1.0
0.8
*
TAP 226( )010
*
TAP 154( )035
*
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
TAP 336( )010
*
F
TAP 224( )035
*
TAP 476( )010
*
G
H
K
N
P
TAP 334( )035
*
TAP 686( )010
*
8
TAP 474( )035
*
TAP 107( )010
*
100
150
220
330
10
10
10
10
TAP 684( )035
*
TAP 157( )010
*
TAP 105( )035
*
TAP 227( )010
*
TAP 155( )035
*
TAP 337( )010
*
R
TAP 225( )035
*
TAP 335( )035
*
16 volt @ 85°C (10 volt @ 125°C)
TAP 475( )035
*
TAP 155( )016
A
A
A
B
C
D
E
F
F
J
L
N
N
R
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
0.5
0.5
0.5
0.6
0.8
1.2
1.9
2.8
4.2
6.0
8.7
12.8
19.2
20.0
4
6
6
6
6
8
8
8
8
8
8
10
10
10
10.0
8.0
6.0
5.0
4.0
3.2
2.5
2.0
1.6
1.3
1.0
0.8
0.6
0.5
TAP 685( )035
*
F
F
H
K
M
N
*
TAP 225( )016
*
TAP 106( )035
*
TAP 335( )016
*
TAP 156( )035
*
TAP 475( )016
*
TAP 226( )035
*
TAP 685( )016
*
TAP 336( )035
*
TAP 106( )016
*
TAP 476( )035
*
TAP 156( )016
*
50 volt @ 85°C (33 volt @ 125°C)
TAP 226( )016
*
TAP 336( )016
*
TAP 104( )050
A
A
A
A
A
B
C
D
E
F
0.1
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.6
0.8
1.3
1.8
2.7
4.0
6.0
8.8
4
4
4
4
4
4
4
4
6
6
6
6
8
8
8
26.0
21.0
17.0
15.0
13.0
10.0
8.0
6.0
3.5
3.0
2.5
*
TAP 476( )016
*
TAP 154( )050
*
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
TAP 686( )016
*
TAP 224( )050
*
TAP 107( )016
*
TAP 334( )050
*
TAP 157( )016
*
TAP 474( )050
*
TAP 227( )016
*
TAP 684( )050
*
TAP 105( )050
*
20 volt @ 85°C (13 volt @ 125°C)
TAP 155( )050
*
TAP 105( )020
A
A
A
B
C
D
E
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
0.5
0.5
0.5
0.5
0.7
1.0
1.6
2.4
3.5
4
4
6
6
6
6
8
8
8
10.0
9.0
7.0
5.5
4.5
3.6
2.9
2.3
1.8
TAP 225( )050
*
*
TAP 155( )020
*
TAP 335( )050
*
TAP 225( )020
*
TAP 475( )050
*
G
H
J
K
L
TAP 335( )020
*
TAP 685( )050
*
6.8
10
15
22
2.0
1.6
1.2
1.0
TAP 475( )020
*
TAP 106( )050
*
TAP 685( )020
*
TAP 156( )050
*
TAP 106( )020
*
TAP 226( )050
*
TAP 156( )020
*
F
H
(*) Insert capacitance tolerance code; M for ±20%, K for ±10% and J for ±5%
TAP 226( )020
*
NOTE: Voltage ratings are minimum values. AVX reserves the right to supply higher
voltage ratings in the same case size.
6
Dipped Radial Capacitors
Tape and Reel Packaging
SOLID TANTALUM RESIN DIPPED TAP
TAPE AND REEL PACKAGING FOR AUTOMATIC COMPONENT INSERTION
TAP types are all offered on radial tape, in reel or ‘ammo’
pack format for use on high speed radial automatic insertion
equipment, or preforming machines.
The tape format is compatible with EIA 468A standard for
component taping set out by major manufacturers of radial
automatic insertion equipment.
TAP – available in three formats. See page 8 for dimensions.
P2
⌬
P
⌬
h
‘B’ wires for normal automatic insertion on
5mm pitch.
H3
H3
H3
W2
W1
d
BRW suffix for reel
BRS suffix for ‘ammo’ pack
H
L
H1
W
Available in case sizes A - J
S
P
D
P1
T
P2
⌬
P
⌬
h
‘C’ wires for preforming.
W2
W1
CRW suffix for reel
CRS suffix for ‘ammo’ pack
d
H
L
H1
W
Available in case sizes A - R
S
P
D
P1
T
P2
⌬
P
⌬
h
‘S’ and ‘D’ wire for special applications,
automatic insertion on 2.5mm pitch.
W2
W1
d
SRW, DTW suffix for reel
SRS, DTS suffix for ‘ammo’ pack
Available in case sizes A - J
H2
L
H1
W
S
P
D
T
P1
S wire
Note: Lead forms may vary slightly from those shown.
7
Dipped Radial Capacitors
Tape and Reel Packaging
SOLID TANTALUM RESIN DIPPED TAP
DIMENSIONS:
Description
millimeters (inches) REEL CONFIGURATION AND
DIMENSIONS:
millimeters (inches)
Code
Dimension
Feed hole pitch
P
12.7 ± 0.3 (0.5 ± 0.01)
Hole center to lead
P1 3.85 ± 0.7 (0.15 ± 0.03)
to be measured at bottom
of clench
Diameter 30
(1.18) max.
5.05 ± 1.0 (0.2 ± 0.04)
for S wire
Hole center to component center
Change in pitch
P2 6.35 ± 0.4 (0.25 ± 0.02)
53 (2.09) max.
∆p ± 1.0 (± 0.04)
45 (1.77) max.
40 (1.57) min.
Lead diameter
d
0.5 ± 0.05 (0.02 ± 0.003)
See wire form table
80
(3.15)
Lead spacing
S
360 (14.17) max.
Component alignment
Feed hole diameter
Tape width
∆h 0 ± 2.0 (0 ± 0.08)
D
4.0 ± 0.2 (0.15 ± 0.008)
Manufactured from cardboard with plastic hub.
W
18.0 + 1.0 (0.7 + 0.04)
- 0.5
- 0.02)
cardboard with plastic hub.
Hold down tape width
Hold down tape position
Lead wire clench height
W1 6.0 (0.24) min.
W2 1.0 (0.04) max.
H
16 ± 0.5 (0.63 ± 0.02)
19 ± 1.0 (0.75 ± 0.04)
on request
Hole position
H1 9.0 ± 0.5 (0.35 ± 0.02)
H2 18 (0.7) min. (S wire only)
H3 32.25 (1.3) max.
Base of component height
Component height
Length of snipped lead
Total tape thickness
L
T
11.0 (0.43) max.
Holding tape outside. Positive terminal leading
(negative terminal by special request).
0.7 ± 0.2 (0.03 ± 0.001)
Carrying card
0.5 ± 0.1 (0.02 ± 0.005)
PACKAGING QUANTITIES
For ‘Ammo’ pack
For bulk products
For Reels
Style
Case code
A, B, C, D
E, F, G
No. of pieces
3000
Style
Case code
A to H
No. of pieces
1000
Style
Case code
No. of pieces
1500
A
TAP
TAP
2500
J to L
500
B, C, D
1250
TAP
H, J
2000
M to R
100
E, F
1000
K, L, M, N, P, R
1000
G, H, J
750
K, L, M, N, P, R
500
AMMO PACK DIMENSIONS
GENERAL NOTES
millimeters (inches) max.
Resin dipped tantalum capacitors are only available taped in
the range of case codes and in the modular quantities by
case code as indicated.
Height 360 (14.17), width 360 (14.17), thickness 60 (2.36)
Packaging quantities on tape may vary by ±1%.
8
Technical Summary and
Application Guidelines
CONTENTS
Section 1: Electrical Characteristics and Explanation of Terms.
Section 2: A.C. Operation and Ripple Voltage.
The following example us es a 22µF 25V capacitor to
illustrate the point.
r A
Section 3: Reliability and Calculation of Failure Rate.
Section 4: Application Guidelines for Tantalum Capacitors.
Section 5: Mechanical and Thermal Properties of
o
C =
d
where
o is the dielectric constant of free space
(8.855 x 10-12 Farads/m)
Leaded Capacitors.
Section 6: Qualification approval status.
r
is the relative dielectric constant for Tantalum
Pentoxide (27)
d
is the dielectric thickness in meters
(for a typical 25V part)
INTRODUCTION
Tantalum capacitors are manufactured from a powder of pure
tantalum metal. The typical particle size is between 2 and 10 µm.
C is the capacitance in Farads
A is the surface area in meters
and
Rearranging this equation gives
Cd
A =
o
r
thus for a 22µF/25V capacitor the surface area is 150 square
centimeters, or nearly 1⁄2 the size of this page.
4000µFV
10000µFV
20000µFV
The powder is compressed under high pressure around a
Tantalum wire to form a ‘pellet’. The riser wire is the anode
connection to the capacitor.
The dielectric is then formed over all the tantalum surfaces
by the electrochemical process of anodization. The ‘pellet’
is dipped into a very weak solution of phosphoric acid.
The dielectric thickness is controlled by the voltage applied
during the forming process. Initially the power supply is kept
in a constant current mode until the correct thickness of
dielectric has been reached (that is the voltage reaches the
‘forming voltage’), it then switches to constant voltage mode
and the current decays to close to zero.
This is subsequently vacuum sintered at high temperature
(typically 1500 - 2000°C). This helps to drive off any impurities
within the powder by migration to the surface.
During s inte ring the p owd e r b e c ome s a s p onge like
structure with all the particles interconnected in a huge
lattice. This structure is of high mechanical strength and
density, but is also highly porous giving a large internal
surface area.
The chemical equations describing the process are as
follows:
Anode:
2 Ta → 2 Ta5+ + 10
e
2 Ta5+ 10 OH-
10 H2O – 10 e
→
→
Ta2O5 + 5 H2O
5H2 + 10 OH-
Cathode:
↑
The larger the surface area the larger the capacitance. Thus
high CV (capacitance/voltage product) powders, which have
a low average particle size, are used for low voltage, high
c a p a c ita nc e p a rts . The figure b e low s hows typ ic a l
powders. Note the very great difference in particle size
between the powder CVs.
The oxide forms on the surface of the Tantalum but it also
grows into the metal. For each unit of oxide two thirds grows
out and one third grows in. It is for this reason that there is a
limit on the maximum voltage rating of Tantalum capacitors
with present technology powders.
By choosing which powder is used to produce each capaci-
ta nc e /volta ge ra ting the s urfa c e a re a c a n b e
controlled.
The dielectric operates under high electrical stress. Consider
a 22µF 25V part:
Formation voltage
=
=
=
Formation Ratio x Working Voltage
4 x 25
100 Volts
19
Technical Summary and
Application Guidelines
The p e ntoxid e (Ta 2O5) d ie le c tric grows a t a ra te of
Tantalum
1.7 x 10-9 m/V
Dielectric thickness (d)
Electric Field strength
=
=
100 x 1.7 x 10-9
0.17 µm
Dielectric
Oxide Film
=
=
Working Voltage / d
147 KV/mm
Manganese
Dioxide
Tantalum
This process is repeated several times through varying
specific densities of Nitrate to build up a thick coat over all
internal and external surfaces of the ‘pellet’, as shown in the
figure.
Dielectric
Oxide Film
The ‘pellet’ is then dipped into graphite and silver to
provide a good connection to the Manganese Dioxide
cathode plate. Electrical contact is established by deposi-
tion of carbon onto the surface of the cathode. The carbon
is then coated with a conductive material to facilitate con-
nection to the cathode termination. Packaging is carried out
to meet individual specifications and customer requirements.
This manufacturing technique is adhered to for the whole
range of AVX tantalum capacitors, which can be subdivided
into four basic groups:
The next stage is the production of the cathode plate.
This is achieved by pyrolysis of Manganese Nitrate into
Manganese Dioxide.
The ‘pellet’ is dipped into an aqueous solution of Nitrate and
then baked in an oven at approximately 250°C to produce
to Dioxide coat. The chemical equation is
Mn (NO3)
→
Mn O2 + 2NO2
↑
2
Chip / Resin dipped / Rectangular boxed / Axial
For furthe r informa tion on p rod uc tion of Ta nta lum
Capacitors see the technical paper "Basic Tantalum
Technology", by John Gill, available from your local AVX
representative.
Anode
Manganese
Dioxide
Graphite
Outer
Silver Layer
Silver
Epoxy
Leadframe
20
Technical Summary and
Application Guidelines
SECTION 1:
ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS
1.1 CAPACITANCE
1.1.1 Rated capacitance (CR)
1.1.3 Capacitance tolerance
This is the nominal rated capacitance. For tantalum capaci-
tors it is measured as the capacitance of the equivalent
series circuit at 20°C in a measuring bridge supplied by a
120 Hz source free of harmonics with 2.2V DC bias max.
This is the permissible variation of the actual value of the
capacitance from the rated value.
1.1.4 Frequency dependence of the capacitance
The effective capacitance decreases as frequency increases.
Beyond 100 kHz the capacitance continues to drop until res-
onance is reached (typically between 0.5-5 MHz depending
on the rating). Beyond this the device becomes inductive.
1.1.2 Temperature dependence on the capacitance
The capacitance of a tantalum capacitor varies with temper-
ature. This variation itself is dependent to a small extent on
the rated voltage and capacitor size. See graph below for
typical capacitance changes with temperature.
1.4
1.2
TYPICAL CAPACITANCE vs. TEMPERATURE
1.0
15
10
5
1.0F 35V
0.8
0.6
0.4
0
100kHz
1kHz
FREQUENCY
100Hz
10kHz
-5
-10
-15
-55
-25
0
25
50
75
100
125
Temperature (°C)
1.2 VOLTAGE
Typical Curve Capacitance vs. Frequency
1.2.1 Rated DC voltage (VR)
100
This is the rated DC voltage for continuous operation up to
+85°C.
90
80
70
60
50
1.2.2 Category voltage (VC)
This is the maximum voltage that may be applied continu-
ously to a capacitor. It is equal to the rated voltage up to
+85°C, beyond which it is subject to a linear derating, to 2/3
V at 125°C.
R
1.2.3 Surge voltage (VS)
This is the highest voltage that may be applied to a capaci-
tor for short periods of time. The surge voltage may be
applied up to 10 times in an hour for periods of up to
30 seconds at a time. The surge voltage must not be used
as a parameter in the design of circuits in which, in the
normal course of operation, the capacitor is periodically
charged and discharged.
75
85
125
95
105
115
Temperature °C
21
Technical Summary and
Application Guidelines
1.2.5 Reverse voltage and non-polar operation
85°C
125°C
The reverse voltage ratings are designed to cover excep-
tional conditions of small level excursions into incorrect
polarity. The values quoted are not intended to cover contin-
uous reverse operation.
Rated
Voltage
(V DC)
Surge
Voltage
(V DC)
Category
Voltage
(V DC)
Surge
Voltage
(V DC)
2
3
4
6.3
10
16
20
25
35
50
2.6
4
5.2
8
13
20
26
33
46
65
1.3
2
2.6
4
6.3
10
13
16
23
33
1.7
2.6
3.4
5
The peak reverse voltage applied to the capacitor must not
exceed:
9
10% of rated DC working voltage to a maximum of
1V at 25°C
3% of rated DC working voltage to a maximum of
0.5V at 85°C
12
16
21
28
40
1% of category DC working voltage to a maximum of
0.1V at 125°C
1.2.6 Non-polar operation
1.2.4 Effect of surges
If the higher reverse voltages are essential, then two capaci-
tors, each of twice the required capacitance and of equal
tolerance and rated voltage, should be connected in a
back-to-back configuration, i.e., both anodes or both
cathodes joined together. This is necessary in order to avoid
a reduction in life expectancy.
The solid Tantalum capacitor has a limited ability to with-
stand surges (15% to 30% of rated voltage). This is in
common with all other electrolytic capacitors and is due to
the fact that they operate under very high electrical stress
within the oxide layer. In the case of ‘solid’ electrolytic
capacitors this is further complicated by the limited self
healing ability of the manganese dioxide semiconductor.
1.2.7 Superimposed AC voltage (Vrms) - Ripple Voltage
This is the maximum RMS alternating voltage, superim-
posed on a DC voltage, that may be applied to a capacitor.
The sum of the DC voltage and the surge value of the
superimposed AC voltage must not exceed the category
It is important to ensure that the voltage across the terminals
of the capacitor does not exceed the surge voltage rating at
any time. This is particularly so in low impedance circuits
where the capacitor is likely to be subjected to the full impact
of surges, especially in low inductance applications. Even
an extremely short duration spike is likely to cause damage.
In such situations it will be necessary to use a higher voltage
rating.
voltage, V . Full details are given in Section 2.
c
1.2.8 Voltage derating
Refer to section 3.2 (page 27) for the effect of voltage
derating on reliability.
1.3 DISSIPATION FACTOR AND TANGENT OF LOSS ANGLE (TAN ␦)
1.3.1 Dissipation factor (DF)
1.3.3 Frequency dependence of dissipation factor
Dissipation factor is the measurement of the tangent of the
loss angle (Tan ␦) expressed as a percentage.
Dissipation Factor increases with frequency as shown in the
typical curves below.
The measurement of DF is carried out at +25°C and 120 Hz
with 2.2V DC bias max. with an AC voltage free of harmonics.
The value of DF is temperature and frequency dependent.
Typical Curve-Dissipation Factor vs. Frequency
100
1.3.2 Tangent of loss angle (Tan ␦)
50
20
This is a measure of the energy loss in the capacitor. It is
expressed as Tan ␦ and is the power loss of the capacitor
divided by its reactive power at a sinusoidal voltage of speci-
fied frequency. (Terms also used are power factor, loss factor
and dielectric loss, Cos (90 - ␦) is the true power factor.) The
measurement of Tan ␦ is carried out at +20°C and 120 Hz
with 2.2V DC bias max. with an AC voltage free of harmonics.
10
5
2
1
100kHz
100Hz
10kHz
FREQUENCY
1kHz
22
Technical Summary and
Application Guidelines
1.3.4 Temperature dependence of dissipation factor
Typical Curves-Dissipation Factor vs. Temperature
Dissipation factor varies with temperature as the typical
curves show to the right. For maximum limits please refer to
ratings tables.
10
100F/6V
5
1F/35V
0
125
80 100
-55 -40 -20
0
20 40 60
Temperature °C
1.4 IMPEDANCE, (Z) AND EQUIVALENT SERIES RESISTANCE (ESR)
1.4.1 Impedance, Z
1.4.3 Frequency dependence of impedance and ESR
This is the ratio of voltage to current at a specified frequency.
Three factors contribute to the impedance of a tantalum
capacitor; the resistance of the semiconducting layer,
the capacitance, and the inductance of the electrodes and
leads.
ESR and impedance both increase with decreasing frequency.
At lower frequencies the values diverge as the extra contri-
butions to impedance (resistance of the semiconducting
layer, etc.) become more significant. Beyond 1 MHz (and
beyond the resonant point of the capacitor) impedance
again increases due to induction.
At high frequencies the inductance of the leads becomes a
limiting factor. The temperature and frequency behavior of
these three factors of impedance determine the behavior of
the impedance Z. The impedance is measured at 25°C and
100 kHz.
Frequency Dependence of Impedance and ESR
1.4.2 Equivalent series resistance, ESR
1k
Resistance losses occur in all practical forms of capacitors.
These are made up from several different mechanisms,
including resistance in components and contacts, viscous
forces within the dielectric, and defects producing bypass
current paths. To express the effect of these losses they are
considered as the ESR of the capacitor. The ESR is fre-
quency dependent. The ESR can be found by using the
relationship:
100
10
1
0.1 µF
0.33 µF
1 µF
Tan ␦
ESR =
10 µF
33 µF
2πfC
0.1
0.01
where f is the frequency in Hz, and C is the capacitance in
farads. The ESR is measured at 25°C and 100 kHz.
100 µF
330 µF
1M
ESR is one of the contributing factors to impedance, and at
high frequencies (100 kHz and above) is the dominant fac-
tor, so that ESR and impedance become almost identical,
impedance being marginally higher.
100
100k
10k
1k
Frequency f (Hz)
Impedance (Z)
ESR
23
Technical Summary and
Application Guidelines
Temperature Dependence of the
Impedance and ESR
1.4.4 Temperature dependence of the impedance and ESR
At 100 kHz, impedance and ESR behave identically and
decrease with increasing temperature as the typical curves
show. For maximum limits at high and low temperatures,
please refer to graph opposite.
100
10
1/35
10/35
47/35
1
0.1
+40 +60
+20
Temperature T (°C)
0
+80 +100 +125
-55 -40 -20
1.5 DC LEAKAGE CURRENT (DCL)
1.5.1 Leakage current (DCL)
Temperature Dependence of the
Leakage Current for a Typical Component
The leakage current is dependent on the voltage applied,
the time, and the capacitor temperature. It is measured
at +25°C with the rated voltage applied. A protective resis-
tance of 1000⍀ is connected in series with the capacitor
in the measuring circuit.
10
Three minutes after application of the rated voltage the leak-
age current must not exceed the maximum values indicated
in the ratings table. Reforming is unnecessary even after
prolonged periods without the application of voltage.
1.5.2 Temperature dependence of the leakage current
1
The leakage current increases with higher temperatures,
typical values are shown in the graph.
For operation between 85°C and 125°C, the maximum
working voltage must be derated and can be found from the
following formula.
R
V max = 1- (T-85) x V volts
0.1
ͧ
ͨ
-55 -40 -20
0
20 40 60
80 100 125
120
TEMPERATURE °C
where T is the required operating temperature. Maximum
Effect of Voltage Derating on Leakage Current
limits are given in rating tables.
1.5.3 Voltage dependence of the leakage current
1
The leakage current drops rapidly below the value corre-
sponding to the rated voltage V when reduced voltages are
R
applied. The effect of voltage derating on the leakage
current is shown in the graph.
This will also give a significant increase in reliability for any
application. See Section 3 for details.
0.1
1.5.4 Ripple current
The maximum ripple current allowance can be calculated
from the power dissipation limits for a given temperature rise
above ambient. Please refer to Section 2 for details.
0.01
0
20
% OF RATED VOLTAGE (VR)
40
60
80 100
24
Technical Summary and
Application Guidelines
SECTION 2:
AC OPERATION — RIPPLE VOLTAGE AND RIPPLE CURRENT
2.1 RIPPLE RATINGS (AC)
In an AC application heat is generated within the capacitor
by both the AC component of the signal (which will depend
upon signal form, amplitude and frequency), and by the DC
leakage. For practical purposes the second factor is insignif-
icant. The actual power dissipated in the capacitor is calcu-
lated using the formula:
affect the values quoted below. It is recommended that
temperature measurements are made on devices during
operating conditions to ensure that the temperature differ-
ential between the device and the ambient temperature is
less than 10°C up to 85°C and less than 2°C between 85°C
and 125°C. Derating factors for temperatures above 25°C
are also shown below. The maximum permissible proven
dissipation should be multiplied by the appropriate derating
factor.
E 2 R
P = I2 R =
Z2
I = rms ripple current, amperes
R = equivalent series resistance, ohms
E = rms ripple voltage, volts
P = power dissipated, watts
Z = impedance, ohms, at frequency under
consideration
For certain applications, e.g., power supply filtering, it may
be desirable to obtain a screened level of ESR to enable
higher ripple currents to be handled. Please contact our
applications desk for information.
2.4 POWER DISSIPATION RATINGS
(IN FREE AIR)
Using this formula it is possible to calculate the maximum
AC ripple current and voltage permissible for a particular
application.
TAR – Molded Axial
Temperature
derating factors
Case
size
Max. power
dissipation (W)
2.2 MAXIMUM AC RIPPLE VOLTAGE
(Emax
)
Temp. °C
Factor
Q
R
S
0.065
0.075
0.09
From the previous equation:
+25
+85
+125
1.0
0.6
0.4
P
max
E(max) = Z
W
0.105
ͱ
R
TAA – Hermetically Sealed Axial
where Pmax is the maximum permissible ripple voltage as
listed for the product under consideration (see table).
Temperature
derating factors
Case
size
Max. power
dissipation (W)
However, care must be taken to ensure that:
1. The DC working voltage of the capacitor must not be
exceeded by the sum of the positive peak of the
applied AC voltage and the DC bias voltage.
Temp. °C Factor
A
B
C
D
0.09
0.10
0.125
0.18
+20
+85
1.0
0.9
0.4
2. The sum of the applied DC bias voltage and the negative
peak of the AC voltage must not allow a voltage reversal
in excess of that defined in the sector, ‘Reverse Voltage’.
+125
TAP – Resin Dipped Radial
Temperature
derating factors
Case
size
A
B
C
D
E
Max. power
dissipation (W)
2.3 MAXIMUM PERMISSIBLE POWER
DISSIPATION (WATTS) @ 25°C
The maximum power dissipation at 25°C has been calculated
for the various series and are shown in Section 2.4, together
with temperature derating factors up to 125°C.
Temp. °C Factor
0.045
0.05
0.055
0.06
0.065
0.075
0.08
0.085
0.09
0.1
+25
+85
+125
1.0
0.4
0.09
F
For leaded components the values are calculated for parts
supported in air by their leads (free space dissipation).
G
H
J
K
L
M/N
P
R
The ripple ratings are set by defining the maximum tempera-
ture rise to be allowed under worst case conditions, i.e.,
with resistive losses at their maximum limit. This differential
is normally 10°C at room temperature dropping to 2°C at
125°C. In application circuit layout, thermal management,
available ventilation, and signal waveform may significantly
0.11
0.12
0.13
0.14
25
Technical Summary and
Application Guidelines
SECTION 3:
RELIABILITY AND CALCULATION OF FAILURE RATE
3.1 STEADY-STATE
Tantalum Dielectric has essentially no wear out mechanism
and in certain circumstances is capable of limited self
healing, random failures can occur in operation. The failure
Voltage Correction Factor
1.0000
rate of Tantalum capacitors will decrease with time and not
increase as with other electrolytic capacitors and other
electronic components.
0.1000
0.0100
Infant
Mortalities
0.0010
0.0001
0
0.9
1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Applied Voltage / Rated Voltage
Figure 2. Correction factor to failure rate F for voltage
derating of a typical component (60% con. level).
Infinite Useful Life
Operating temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3. This graph gives a correc-
tion factor FT for any temperature of operation.
Useful life reliability can be altered by voltage
derating, temperature or series resistance
Figure 1. Tantalum reliability curve.
Temperature Correction Factor
The useful life reliability of the Tantalum capacitor is affected
by three factors. The equation from which the failure rate
can be calculated is:
100.0
F = FU x FT x FR x FB
where FU is a correction factor due to operating voltage/
voltage derating
10.0
1.0
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
0.10
0.01
FB is the basic failure rate level. For standard
Tantalum product this is 1%/1000hours
20 30
40
50
60
70
80 90
110 120
100
Operating voltage/voltage derating
Temperature
If a capacitor with a higher voltage rating than the maximum
line voltage is used, then the operating reliability will be
improved. This is known as voltage derating. The graph,
Figure 2, shows the relationship between voltage derating
(the ratio between applied and rated voltage) and the failure
rate. The graph gives the correction factor FU for any
operating voltage.
Figure 3. Correction factor to failure rate F for ambient
temperature T for typical component (60% con. level).
26
Technical Summary and
Application Guidelines
Circuit Impedance
3.2 DYNAMIC
All s olid tantalum capacitors require current limiting
resistance to protect the dielectric from surges. A series
resistor is recommended for this purpose. A lower circuit
impedance may cause an increase in failure rate, especially
at temperatures higher than 20°C. An inductive low imped-
ance circuit may apply voltage surges to the capacitor and
similarly a non-inductive circuit may apply current surges
to the capacitor, causing localized over-heating and failure.
The recommended impedance is 1Ω per volt. Where this is
not feasible, equivalent voltage derating should be used
(See MIL HANDBOOK 217E). Table I shows the correction
factor, FR, for increasing series resistance.
As stated in Section 1.2.4, the solid Tantalum capacitor has
a limited ability to withstand voltage and current surges.
S uc h c urre nt s urge s c a n c a us e a c a p a c itor to fa il.
The expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability. The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance.The table below summarizes the results of
trials carried out at AVX with a piece of equipment which
has very low series resistance and applied no derating. So
that the capacitor was tested at its rated voltage.
Results of production scale derating experiment
Table I: Circuit Impedance
Capacitance and Number of units 50% derating No derating
Correction factor to failure rate F for series resistance R
on basic failure rate FB for a typical component (60%
con. level).
Voltage
47µF 16V
100µF 10V
22µF 25V
tested
applied
0.03%
0.01%
0.05%
applied
1,547,587
632,876
1.1%
0.5%
Circuit Resistance ohms/volt
FR
2,256,258
0.3%
3.0
2.0
1.0
0.8
0.6
0.4
0.2
0.1
0.07
0.1
0.2
0.3
0.4
0.6
0.8
1.0
As can clearly be seen from the results of this experiment,
the more derating applied by the user, the less likely the
probability of a surge failure occurring.
It must be remembered that these results were derived from
a highly accelerated surge test machine, and failure rates in
the low ppm are more likely with the end customer.
Example calculation
Consider a 12 volt power line. The designer needs about
10µF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier. Thus the circuit impedance will
be limited only by the output impedance of the boards
power unit and the track resistance. Let us assume it to be
about 2 Ohms minimum, i.e., 0.167 Ohms/Volt. The operat-
ing temperature range is -25°C to +85°C. If a 10µF 16 Volt
capacitor was designed-in, the operating failure rate would
be as follows:
a) FT = 0.8 @ 85°C
b) FR = 0.7 @ 0.167 Ohms/Volt
c) FU = 0.17 @ applied voltage/rated voltage = 75%
Thus FB = 0.8 x 0.7 x 0.17 x 1 = 0.0952%/1000 Hours
If the capacitor was changed for a 20 volt capacitor, the
operating failure rate will change as shown.
FU = 0.05 @ applied voltage/rated voltage = 60%
FB = 0.8 x 0.7 x 0.05 x 1 = 0.028%/1000 Hours
27
Technical Summary and
Application Guidelines
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen. This can be disproved
by the results of an experiment carried out at AVX on 47µF
10V s urface mount capacitors with different leakage
currents. The results are summarized in the table below.
An added bonus of increasing the derating applied in a
circuit, to improve the ability of the capacitor to withstand
surge conditions, is that the steady-state reliability is
improved by up to an order. Consider the example of a
6.3 volt capacitor being used on a 5 volt rail. The steady-
state reliability of a Tantalum capacitor is affected by three
parameters; temperature, series resistance and voltage
derating. Assuming 40°C operation and 0.1Ω/volt of series
resistance, the scaling factors for temperature and series
resistance will both be 0.05 [see Section 3.1]. The derating
factor will be 0.15. The capacitors reliability will therefore be
Leakage Current vs Number of Surge Failures
Number tested Number failed surge
Standard leakage range
0.1 µA to 1µA
10,000
10,000
10,000
25
26
25
Failure rate = FU x FT x FR x 1%/1000 hours
= 0.15 x 0.05 x 1 x 1%/1000 hours
= 7.5% x 10-3/hours
Over Catalog limit
5µA to 50µA
Classified Short Circuit
50µA to 500µA
If a 10 volt capacitor was used instead, the new scaling factor
would be 0.017, thus the steady-state reliability would be
Again, it must be remembered that these results were
derived from a highly accelerated surge test machine,
and failure rates in the low ppm are more likely with the end
customer.
Failure rate = FU x FT x FR x 1%/1000 hours
= 0.017 x 0.05 x 1 x 1%/1000 hours
= 8.5% x 10-4/ 1000 hours
So there is an order improvement in the capacitors steady-
state reliability.
AVX recommended derating table
Voltage Rail
Working Cap Voltage
3.3
5
6.3
3.3 RELIABILITY TESTING
AVX performs extensive life testing on tantalum capacitors.
10
10
12
15
≥24
20
■ 2,000 hour tests as part of our regular Quality Assurance
Program.
25
35
Test conditions:
Series Combinations (11)
■ 85°C/rated voltage/circuit impedance of 3Ω max.
■ 125°C/0.67 x rated voltage/circuit impedance of 3Ω max.
3.4 Mode of Failure
For further details on surge in Tantalum capacitors refer
to J.A. Gill’s paper “Surge in Solid Tantalum Capacitors”,
available from AVX offices worldwide.
This is normally an increase in leakage current which ultimately
becomes a short circuit.
28
Technical Summary and
Application Guidelines
SECTION 4:
APPLICATION GUIDELINES FOR TANTALUM CAPACITORS
4.1 SOLDERING CONDITIONS AND
BOARD ATTACHMENT
4.2 RECOMMENDED SOLDERING
PROFILES
The soldering temperature and time should be the minimum
for a good connection.
Recommended wave soldering profile for mounting of
tantalum capacitors except MINITANs* is shown below.
A suitable combination for wavesoldering is 230 - 250°C for
3 - 5 seconds.
After soldering the assembly should preferably be allowed to
cool naturally. In the event that assisted cooling is used, the
rate of change in temperature should not exceed that used
in reflow.
Small parametric shifts may be noted immediately after
wave solder, components should be allowed to stabilize at
room temperature prior to electrical testing.
*Note: TMH and TMM Series are not recommended for wave soldering
.
AVX leaded tantalum capacitors are designed for wave
soldering operations.
Allowable range of peak temp./time combination for wave soldering
270
260
Dangerous Range
250
Temperature 240
o
(
C)
230
Allowable Range
with Care
220
210
200
Allowable Range
with Preheat
0
2
4
6
8
10
12
Soldering Time (secs.)
*See appropriate product specification
SECTION 5:
MECHANICAL AND THERMAL PROPERTIES, LEADED CAPACITORS
5.1 ACCELERATION
5.6 SOLDERING CONDITIONS
10 g (981 m/s)
Dip soldering permissible provided solder bath temperature
Ϲ270°C; solder time <3 sec.; circuit board thickness
м1.0 mm.
5.2 VIBRATION SEVERITY
10 to 2000 Hz, 0.75 mm or 98 m/s2
5.7 INSTALLATION INSTRUCTIONS
The upper temperature limit (maximum capacitor surface
temperature) must not be exceeded even under the most
unfavorable conditions when the capacitor is installed. This
must be considered particularly when it is positioned near
components which radiate heat strongly (e.g., valves and
power transistors). Furthermore, care must be taken, when
bending the wires, that the bending forces do not strain the
capacitor housing.
5.3 SHOCK
Trapezoidal Pulse 10 g (981 m/s) for 6 ms
5.4 TENSILE STRENGTH OF
CONNECTION
10 N for type TAR, 5 N for type TAP. (See MINITAN Section
for limits.)
5.8 INSTALLATION POSITION
No restriction.
5.5 BENDING STRENGTH OF
CONNECTIONS
5.9 SOLDERING INSTRUCTIONS
Fluxes containing acids must not be used.
2 bends at 90°C with 50% of the tensile strength test load-
ing. (See Minitan Section for limits.)
29
Technical Summary and
Application Guidelines
The two resistors are used to ensure that the leakage
currents of the capacitors does not affect the circuit
reliability, by ensuring that all the capacitors have half the
working voltage across them.
QUESTIONS AND ANSWERS
Some commonly asked questions regarding Tantalum
Capacitors:
Que s tion: If I use several tantalum capacitors in serial/
parallel combinations, how can I ensure equal current and
voltage sharing?
Question: What are the advantages of tantalum over other
capacitor technologies?
Answer:
Ans we r: Connecting two or more capacitors in series
and parallel combinations allows almost any value and
ra ting to b e c ons truc te d for us e in a n a p p lic a tion.
For example, a capacitance of more than 60µF is required in
a circuit for stable operation. The working voltage rail is 24
Volts dc with a superimposed ripple of 1.5 Volts at 120 Hz.
1. Tantalums have high volumetric efficiency.
2. Electrical performance over temperature is very stable.
3. They have a wide operating temperature range -55
degrees C to +125 degrees C.
4. They have better frequency characteristics than
aluminum electrolytics.
The maximum voltage seen by the capacitor is Vdc
+
V =25.5V
ac
5. No wear out mechanism. Because of their construction,
solid tantalum capacitors do not degrade in perfor-
mance or reliability over time.
Applying the 50% derate rule tells us that a 50V capacitor
is required.
Conne c ting two 25V ra te d c a p a c itors in s e rie s will
give the required capacitance voltage rating, but the
effective capacitance will be halved, so for greater than
Question: If the part is rated as a 25 volt part and you have
current surged it, why can’t I use it at 25 volts in a low
impedance circuit?
Answer: The high volumetric efficiency obtained using tan-
talum technology is accomplished by using an extremely
thin film of tantalum pentoxide as the dielectric. Even an
application of the relatively low voltage of 25 volts will pro-
duce a large field strength as seen by the dielectric. As a
result of this, derating has a significant impact on reliability
as described under the reliability section. The following
example uses a 22 microfarad capacitor rated at 25 volts to
illustrate the point. The equation for determining the amount
of surface area for a capacitor is as follows:
33µF
16.5µF
25V
50V
➡
33µF
25V
60µF, four such series combinations are required, as
shown.
C = ( (E) (E ) (A) ) / d
°
A = ( (C) (d) ) /( (E )(E) )
°
A = ( (22 x 10-6) (170 x 10-9) ) / ( (8.85 x 10-12) (27) )
A = 0.015 square meters (150 square centimeters)
Where C = Capacitance in farads
33µF
66µF
50V
25V
➡
A = Dielectric (Electrode) Surface Area (m2)
d = Dielectric thickness (Space between dielectric) (m)
E = Dielectric constant (27 for tantalum)
In order to ensure reliable operation, the capacitors should
be connected as shown below to allow current sharing of
the ac noise and ripple signals. This prevents any one
capacitor heating more than its neighbors and thus being
the weak link in the chain.
E°= Dielectric Constant relative to a vacuum
(8.855 x 10-12 Farads x m-1)
To compute the field voltage potential felt by the dielectric
we use the following logic.
+
•
•
Dielectric formation potential = Formation Ratio x
Working Voltage
100K
•
•
•
•
= 4 x 25
Formation Potential = 100 volts
Dielectric (Ta2O5) Thickness (d) is 1.7 x 10-9 Meters Per Volt
d = 0.17 µ meters
•
•
100K
100K
•
•
Electric Field Strength = Working Voltage / d
= (25 / 0.17 µ meters)
= 147 Kilovolts per millimeter
= 147 Megavolts per meter
30
Technical Summary and
Application Guidelines
QUESTIONS AND ANSWERS
No matter how pure the raw tantalum powder or the preci-
sion of processing, there will always be impurity sites in the
dielectric. We attempt to stress these sites in the factory
with overvoltage surges, and elevated temperature burn in
so that components will fail in the factory and not in your
product. Unfortunately, within this large area of tantalum
pentoxide, impurity sites will exist in all capacitors. To mini-
mize the possibility of providing enough activation energy for
these impurity sites to turn from an amorphous state to a
crystalline state that will conduct energy, series resistance
and derating is recommended. By reducing the electric field
within the anode at these sites, the tantalum capacitor has
increased reliability. Tantalums differ from other electrolytics
in that charge transients are carried by electronic conduc-
tion rather than absorption of ions.
Ques tion: I have read that manufacturers recommend a
series resistance of 0.1 ohm per working volt. You suggest
we use 1 ohm per volt in a low impedance circuit. Why?
Answer: We are talking about two very different sets of circuit
conditions for those recommendations. The 0.1 ohm per volt
recommendation is for steady-state conditions. This level of
resistance is used as a basis for the series resistance variable
in a 1% / 1000 hours 60% confidence level reference. This
is what steady-state life tests are based on. The 1 ohm per
volt is recommended for dynamic conditions which include
current in-rush applications such as inputs to power supply
circuits. In many power supply topologies where the di / dt
through the capacitor(s) is limited, (such as most implementa-
tions of buck (current mode), forward converter, and flyback),
the requirement for series resistance is decreased.
Que s tion: What negative transients can Solid Tantalum
Capacitors operate under?
Question: How long is the shelf life for a tantalum capacitor?
Ans wer: Solid tantalum capacitors have no limitation on
shelf life. The dielectric is stable and no reformation is
required. The only factors that affect future performance of
the capacitors would be high humidity conditions and
extreme storage temperatures. Solderability of solder coated
surfaces may be affected by storage in excess of one year
under temperatures greater than 40 degrees C or humidities
greater than 80% relative humidity. Terminations should be
checked for solderability in the event an oxidation develops
on the solder plating.
Answer: The reverse voltage ratings are designed to cover
exceptional conditions of small level excursions into incor-
rect polarity. The values quoted are not intended to cover
continuous reverse operation. The peak reverse voltage
applied to the capacitor must not exceed:
10% of rated DC working voltage to a maximum of
1 volt at 25 degrees C.
3% of rated DC working voltage to a maximum of 0.5
volt at 85 degrees C.
1% of category DC working voltage to a maximum of
0.1 volt at 125 C.
31
Technical Publications
1. Steve Warden and John Gill, “Application Guidelines
on IR Re flow of Surfa c e Mount Solid Ta nta lum
Capacitors.”
15. R.W. Franklin, “Equivalent Series Resistance of
Tantalum Capacitors,” AVX Ltd.
16. J ohn Stroud, “Molded Surface Mount Tantalum
Capacitors vs Conformally Coated Capacitors,”
AVX Corporation, Tantalum Division
2. John Gill, “Glossary of Terms used in the Tantalum
Industry.”
3. R.W. Franklin, “Over-Heating in Failed Tantalum
Capacitors,” AVX Ltd.
17. Chris Reynolds, “Reliability Management of Tantalum
Capacitors,” AVX Tantalum Corporation
4. R.W. Franklin, “Upgraded Surge Performance of
Tantalum Capacitors,” Electronic Engineering 1985
18. R.W. Franklin, “Ripple Rating of Tantalum Chip
Capacitors,” AVX Ltd.
5. R.W. Fra nklin, “S c re e ning b e a ts s urge thre a t,”
Electronics Manufacture & Test, June 1985
19. Chris Reynolds, “Setting Standard Sizes for Tantalum
Chips,” AVX Corporation
6. AVX Surface Mounting Guide
20. J ohn Gill, “Surge In Solid Tantalum Capacitors,”
AVX Ltd.
7. Ian Salis bury, “Thermal Management of Surface
Mounted Tantalum Capacitors,” AVX
21. David Mattingly, “Increasing Reliability of SMD
Ta nta lum Ca p a c itors in Low Imp e d a nc e
Applications,” AVX Corporation
8. John Gill, “Investigation into the Effects of Connecting
Tantalum Capacitors in Series,” AVX
22. John Gill, “Basic Tantalum Technology,” AVX Ltd.
9. Ian Salisbury, “Analysis of Fusing Technology for
Tantalum Capacitors,” AVX-Kyocera Group Company
23. Ian Salisbury, “Solder Update Reflow Mounting
TACmicrochip Tantalum Capacitor,” AVX Ltd.
10. R.W. Franklin, “Analysis of Solid Tantalum Capacitor
Leakage Current,” AVX Ltd.
24. Ian Salisbury, “New Tantalum Capacitor Design for
0603 Size,” AVX Ltd.
11. R.W. Franklin, “An Exploration of Leakage Current,”
AVX, Ltd.
25. J ohn Gill, “Capacitor Technology Comparison,”
AVX Ltd.
12. William A. Millman, “Application Specific SMD
Tantalum Capacitors,” Technical Operations, AVX
Ltd.
26. Scott Chiang, “High Performance CPU Capacitor
Requirements, how AVX can help,” AVX Kyocera
Taiwan
13. R.W. Franklin, “Capacitance Tolerances for Solid
Tantalum Capacitors,” AVX Ltd.
27. John Gill and Ian Bishop, "Reverse Voltage Behavior
of Solid Tantalum Capacitors."
14. Arc h G. Ma rtin, “De c oup ling Ba s ic s ,” AVX
Corporation
NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and
data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement
and are not recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required.
Specifications are typical and may not apply to all applications.
32
相关型号：
TAP154M050CCS
Tantalum Capacitor, Polarized, Tantalum (dry/solid), 50V, 20% +Tol, 20% -Tol, 0.15uF, Through Hole Mount, 1818, RADIAL LEADED
KYOCERA AVX
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